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ZXTN19060CG资料

2023-10-22 来源:九壹网
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ZXTN19060CG

60V NPN low sat medium power transistor in SOT223Summary

BVCEO > 60VBVCEX > 160VBVECO > 6VIC(cont) = 7A

VCE(sat) < 50mV @ 1A RCE(sat) = 30mΩPD = 3.0W

Complementary part number ZXTP19060CG

Description

Packaged in the SOT223 outline this new low saturation NPN transistoroffers extremely low on state losses making it ideal for use in DC-DCcircuits and various driving and power management functions.

CBFeatures

•••••

Higher power dissipation SOT223 packageHigh peak currentLow saturation voltage160V forward blocking voltage6V reverse blocking voltage

EApplications

••

Motor drive

Lamp, relay and solenoid drive

ECCBPinout - top viewOrdering information

Device

ZXTN19060CGTA

Reel size (inches)

7

Tape width (mm)

12

Quantity per reel1000

Device marking

ZXTN19060C

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ZXTN19060CG

Absolute maximum ratings

Parameter

Collector-Base voltage

Collector-Emitter voltage (forward blocking)Collector-Emitter voltage

Emitter-Collector voltage (reverse blocking)Emitter-Base voltage

Continuous Collector current(c)Base currentPeak pulse current

Power dissipation at TA =25°C(a)Linear derating factor

Power dissipation at TA =25°C(b)Linear derating factor

Power dissipation at TA =25°C(c)Linear derating factor

Power dissipation at TA =25°C(d)Linear derating factor

Power dissipation at TC =25°C(e)Linear derating factor

Operating and storage temperature range

Tj, TstgPDPDPDPDSymbolVCBOVCEXVCEOVECXVEBOICIBICMPD

Limit160160606771121.29.61.612.83.0245.34210.281-55 to 150UnitVVVVVAAAWmW/°CWmW/°CWmW/°CWmW/°CWmW/°C°C

Thermal resistance

Parameter

Junction to ambient(a)Junction to ambient(b)Junction to ambient(c)Junction to ambient(d)Junction to case(e)

SymbolR⍜JAR⍜JAR⍜JAR⍜JAR⍜JC

Limit104784223.512.3

Unit°C/W°C/W°C/W°C/W°C/W

NOTES:

(a)For a device surface mounted on 15mm x 15mm x 0.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.

(b)Mounted on 25mm x 25mm x 0.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.(c)Mounted on 50mm x 50mm x 0.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions.(d)As (c) above measured at t<5 seconds.(e)Junction to case (collector tab). Typical

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ZXTN19060CG

Thermal characteristics

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ZXTN19060CG

Electrical characteristics (at Tamb = 25°C unless otherwise stated).

ParameterSymbolCollector-Base breakdown BVCBOvoltage

Collector-Emitter BVCEXbreakdown voltage (forward blocking)Collector-Emitter breakdown voltageEmitter-Collector Breakdown Voltage (Reverse Blocking)Emitter-Collector breakdown voltage (reverse blocking)

Emitter-Base breakdown voltage

Collector-Base cut-off current

Collector-Emitter cut-off current

Emitter cut-off currentCollector-Emitter saturation voltage

BVCEOBVECX

Min.160160Typ.200200Max.UnitVVConditionsIC = 100␮AIC = 100␮A, RBE < 1kΩ or

-1V < VBE < 0.25VIC = 10mA (*)

IE = 100␮A, RBC < 1kΩ or

0.25V > VBC > -0.25VIE = 100␮AIE = 100␮AVCB = 160VVCB = 160V, Tamb= 100°CVCE = 160V, RBE < 1kΩ or

-1V < VBE < 0.25VVEB = 5.6VIC = 1A, IB = 100mA(*)IC = 1A, IB = 10mA(*)IC = 2A, IB = 40mA(*)IC = 7A, IB = 700mA(*)IC = 7A, IB = 700mA(*)IC = 7A, VCE = 2V(*)IC = 100mA, VCE = 2V(*)IC = 2A, VCE = 2V(*)IC = 7A, VCE = 2V(*)IC = 50mA, VCE = 10Vf = 100MHz

VEB = 0.5V, f = 1MHz(*)VCB = 10V, f = 1MHz(*)IC = 500mA, VCC = 10V,IB1 = -IB2 = 50mA

606757VVBVECOBVEBOICBOICEX

67V

78.3<1500.5100

VnA␮AnA

IEBOVCE(sat)

Base-Emitter saturation voltage

Base-Emitter turn-on voltage

Static forward current transfer ratioTransition frequencyInput capacitanceOutput capacitanceDelay timeRise timeStorage timeFall timeVBE(sat)VBE(on)hFE

20016025

<13710511020010509603002204013031019.727.313.268290.3505015515030011501050500

nAmVmVmVmVmVmVfTCiboCobotdtrtstf

MHz40025pFpFnsnsnsnsNOTES:

(*)Measured under pulsed conditions. Pulse width ≤ 300µs; duty cycle ≤ 2%.

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元器件交易网www.cecb2b.comZXTN19060CGTypical characteristicsIssue 1 - February 2008

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ZXTN19060CG

Intentionally left blank

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ZXTN19060CG

Package outline - SOT223

Dim.AA1A2bb2C

MillimetersMin.-0.021.550.662.900.23

Max.1.800.101.650.843.100.33

-

InchesMin.0.00080.06100.0260.1140.009

Max.0.0710.0040.06490.0330.1220.013

Dim.Dee1EE1L

MillimetersMin.6.30

Max.6.70

InchesMin.0.248

Max.0.264

2.30 BSC4.60 BSC6.703.300.90

7.303.70-

0.0905 BSC0.181 BSC0.2640.1300.355

0.2870.146-

Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches

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ZXTN19060CG

Definitions

Product change

Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product orservice. Customers are solely responsible for obtaining the latest relevant information before placing orders.Applications disclaimer

The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit forthe user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever isassumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rightsarising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract,tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract,opportunity or consequential loss in the use of these circuit applications, under any circumstances.Life support

Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express writtenapproval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein:A. Life support devices or systems are devices or systems which:

1.are intended to implant into the body or

2.support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in thelabeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to

cause the failure of the life support device or to affect its safety or effectiveness.Reproduction

The product specifications contained in this publication are issued to provide outline information only which (unless agreed by thecompany in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as arepresentation relating to the products or services concerned. Terms and Conditions

All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict between the twowhen the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement.For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office.Quality of product

Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer.

To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of ourregionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork

Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels.ESD (Electrostatic discharge)

Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices.The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extentof damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time.Devices suspected of being affected should be replaced.Green compliance

Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding reg-ulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reducethe use of hazardous substances and/or emissions.

All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance withWEEE and ELV directives.Product status key:“Preview”Future device intended for production at some point. Samples may be available“Active”Product status recommended for new designs“Last time buy (LTB)”Device will be discontinued and last time buy period and delivery is in effect“Not recommended for new designs”Device is still in production to support existing designs and production“Obsolete”Production has been discontinuedDatasheet status key:“Draft version”This term denotes a very early datasheet version and contains highly provisional information, which

may change in any manner without notice.

“Provisional version”This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance.

However, changes to the test conditions and specifications may occur, at any time and without notice.

“Issue”This term denotes an issued datasheet containing finalized specifications. However, changes to

specifications may occur, at any time and without notice.Zetex sales officesEurope

Zetex GmbH

Kustermann-parkBalanstraße 59D-81541 MünchenGermany

Telefon: (49) 89 45 49 49 0Fax: (49) 89 45 49 49 49europe.sales@zetex.com

Americas

Zetex Inc

700 Veterans Memorial HighwayHauppauge, NY 11788USA

Telephone: (1) 631 360 2222Fax: (1) 631 360 8222usa.sales@zetex.com

Asia Pacific

Zetex (Asia Ltd)

3701-04 Metroplaza Tower 1Hing Fong Road, Kwai FongHong Kong

Telephone: (852) 26100 611Fax: (852) 24250 494asia.sales@zetex.com

Corporate Headquarters

Zetex Semiconductors plc

Zetex Technology Park, ChaddertonOldham, OL9 9LLUnited Kingdom

Telephone: (44) 161 622 4444Fax: (44) 161 622 4446hq@zetex.com

© 2008 Published by Zetex Semiconductors plc

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