FastLock Type
E-tec is now the leading BGA socket manufacturer.
EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries.
FastLock sockets are available for any chip size and grid pattern. The SMT socket is simply placed and reflowed onto the PCB in the same way as the chip and occupies only a small amount of additional board space. The solderless sockets are mounted with 2 or 4 mounting pegs to the PCB depending on the chip size. The FastLock retainer uses a thumbscrew which does not require any tools for opening/closing of the socket. Torque tools or adjustment of pressdown force are available with this locking system also.
We aim to solve your requirements - many different terminals and configurations are available. Your custom sets our standards!
Please note, we will always request the chip data to ensure we offer a compatible socket.
FastLock Type
SMT style Soldertail style Solderless Compression style (FastLock Type as example shown) PCB Pad Layout PCB Pad Layout Ø 0,42mm/.016” if pitch 1,27mm Ø 0,29mm/.011” if pitch 1,00mm Ø 0,29mm/.011” if pitch 0,80mm Ø 0,27mm/.010” if pitch 0,75mm Ø 0,27mm/.010” if pitch 0,65mm Ø 0,27mm/.010” if pitch 0,50mm Ø 0,17mm/.007” if pitch 0,40mm Soldertail dimension: PCB Pad Layout Ø 0,60mm/.024“ if pitch 1,27mm Ø 0,50mm/.020“ if pitch 1,00mm Ø 0,40mm/.016“ if pitch 0,80mm Ø 0,35mm/.014“ if pitch 0,75mm Ø 0,35mm/.014“ if pitch 0,65mm Ø 0,30mm/.012“ if pitch 0,50mm PCB solder hole: Ø 0,60mm/.024” if pitch 1,27mm You may request any specific socket dimension from info@e-tec.com gold plated pads Ø 0,70mm/.027“ if pitch 1,27mm Ø 0,50mm/.020” if pitch 1,00mm gold plated pads Ø 0,60mm/.024“ if pitch 1,00mm Ø 0,40mm/.016” if pitch 0,80mm gold plated pads Ø 0,50mm/.020“ if pitch 0,80mm Ø 0,35mm/.014” if pitch 0,75mm gold plated pads Ø 0,45mm/.018“ if pitch 0,75mm Ø 0,35mm/.014” if pitch 0,65mm gold plated pads Ø 0,40mm/.016“ if pitch 0,65mm Ø 0,35mm/.014” if pitch 0,50mm gold plated pads Ø 0,35mm/.012“ if pitch 0,50mm Ø 0,25mm/.010” if pitch 0,40mm
gold plated pads Ø 0,25mm/.010“ if pitch 0,40mm Solderless Compression Type and other locking systems FastLock Type
QuickLock Type
ClamShell Type
Specifications
Mechanical data
Contact life
Retention System life Solderability
Individual contact force Insulator (RoHS compliant) Terminal (RoHS compliant) Contact (RoHS compliant)
10.000 cycles min. 10.000 cycles min. as per IEC 60068-2-58 40 grams max.
Material
Electrical data
High temp plastic or epoxy FR4 Brass BeCu
< 100 mΩ 500 mA max.
100 MΩ if 0.50 to 0.80mm pitch
pitch upwards 500 MΩ 1.00mm
500V min. < 1 pF < 2 nH
−55°C to +125°C ; 260°C for 60 sec.
Contact resistance Current rating
Insulation resistance at 500V DC
Breakdown voltage at 60 Hz Capacitance Inductance
Operating temperature
Recommendations: Solder paste – Please use a solder paste w/o any silver! Solder profile – Please refer to our website www.e-tec.com
E-tec solderless sockets are adapted to a standard PCB thickness of 1.60mm. For a different PCB thickness, please inform E-tec first!
SMT FastLock Sockets are recommended to be ordered with locating pegs for soldering to the PCB, to avoid the solderjoints from being stressed due to the torque forces
applied with this locking system. If used without locating pegs, the life cycle of the socket may be heavily reduced.
For high pincount SMT sockets, E-tec recommends the use of a pluggable thru-hole socket mounted into a minigrid adapter (see also pages 15, 16 & 16a for more details).
X X F x x x x - x x x x - x xX X 55 L Pitch 04 = 0,40mm 05 = 0,50mm 06 = 0,65mm 07 = 0,75mm 08 = 0,80mm 10 = 1,00mm 12 = 1,27mm 15 = 1,50mm others on request How to order
optional for locating pegs
Device Type Device Material B = Ball Grid L = Land Grid C = Column Grid Grid Code Config Code will be given by the factory after receipt of the chip datasheet Plating (tin leadfree) C = P U std. socket for ceramic device 95 = tin/gold 55 = gold to small diameter solderballs = std. socket for plastic device = socket adapted only for solderless Compression Type Socket Type F = FastLock (standard) Nbr of contacts depends on ballcount of chip Contact Type 30 = standard SMT…( „A“=1,20mm if 1,27mm pitch; 0,80mm if 1,00mm pitch, 0.60 if 0,80mm pitch; 0,40mm if <0.80mm pitch ) 29 = raised SMT...( „A“ = 5,00mm if 1,27mm pitch; 3,20mm if 1,00mm pitch; 2,80mm if 0,80mm pitch, 2.30mm if <0.80mm pitch ) 28 = special raised SMT - only for 1.00 & 0.80mm pitch….....( „A“ = 4,50mm ) 70 = standard solder tail………( „A“ = 3.30 if 1.27mm pitch, 2.80 if 1.00mm or 0.80mm pitch, 2,30mm if <0.80mm pitch) 90 = solderless Compression Type… C = Clamshell Q = QuickLock others on request 14b
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