专利名称：METHOD FOR PRODUCING AN INTEGRATED
CIRCUIT PRODUCT HAVING A POLYIMIDEFILM INTERCONNECTION STRUCTURE ANDPRODUCT FABRICATED THEREBY
发明人：WILSON, ARTHUR M.申请号：EP86117768申请日：19861219公开号：EP0232533A3公开日：19880817
摘要：A method for making integrated circuits in which a polyimide/conductormultilevel film (17) is cast on a substrate (10), using available or existing semiconductorprocessing equipment. The polyimide film (17) is formed from readily available polyamicacid resins, and the conductor (16) can be sputtered aluminium formed to
interconnection conductor patterns (16, 16') by standard photolithographic techniques.After fabrication of the multilayer film (17), the conductors (16, 16') of the film (17) andthe device circuit (30) are brought into aligned contact, and the device circuit (30) affixedto the film (17). The film (17) and the device circuit (30) are then removed from thesubstrate (10) for further processing, such as bonding the device and film to a motherboard or leadframe, as desired.
申请人：TEXAS INSTRUMENTS INCORPORATED
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