专利名称：APPARATUS AND METHOD FOR BAKING
SUBSTRATE
发明人：Meina Zhu,Yi Dai申请号：US13704300申请日：20120928
公开号：US20140178056A1公开日：20140626
专利附图：
摘要：The present invention discloses an apparatus for baking a substrate. Theapparatus includes a supporting platform, a plurality of supporting pins, a heating unit,and a thermal insulation layer. The supporting platform has a supporting surface and a
bottom surface. The supporting pins are disposed in the supporting platform, and thesupporting pins are capable of movably protruding from the supporting surface to liftthe substrate up. The heating unit is utilized to heat the substrate. The thermal insulationlayer is disposed opposite to the bottom surface of the supporting platform and utilizedto prevent the heating unit from heating the supporting platform. The present inventionfurther discloses a method for baking a substrate, and the method can effectivelyprevent a Mura defect appearing on the substrate.
申请人：Meina Zhu,Yi Dai
地址：Shenzhen CN,Shenzhen CN
国籍：CN,CN
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